Xiaomi is expected to unveil the Mi MIX 2s at Mobile World Congress (MWC) 2018 in Barcelona in the second half of February. The Mi Mix 2s is expected to pack a Snapdragon 845 flagship chip, which is expected to be featured in almost all high-end Android handsets this year. Also listed is a 5.99-inch display which is a full-view display with highly reduced bezels that appears to have top and bottom chins slimmer than the ones on the previously launched Mi MIX 2. The handset is also tipped to come with 8GB of RAM and 256GB of storage which may likely be on one of the variants. There should be a 6GB RAM-packing variant as well.
A render posted on Weibo shows a design schematic describing key features of the handset. The device is expected to feature Full Screen Display 3.0 technology, a four-sided curved ceramic unibody, 8GB LPDDR4X RAM, 256GB UFS inbuilt storage, a 12-megapixel dual camera, and global 4G LTE bands. The phone could also be Xiaomi\'s first to sport an under display fingerprint sensor. However, the same leak shows a rear-mounted fingerprint sensor as well.
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An interesting highlights of handset shots in both images is the appointment of front cameras at the top right part of the display. All these features and specifications are currently part of speculation and there is no official communication from Xiaomi. We might have to wait till MWC 2018 when Xiaomi is expected to unveil the MIX 2s smartphone.