As yet, global village has received a bevy of rumors related to the next-iteration of Oppo, called R7, which is expected to come with some appealing aspects such as crazy thin profile with some bezels and metal unibody. Amid of all these hearsay, now yet another creation of tech giant: R7 Plus has made its appearance over cyberspace that is basically a bigger sibling of R7.
First spotted by gforgames.com, a couple of images related to both the upcoming smartphones have been shared by China based Weibo site, whereby some aspects of these phones have come into view before proclamation. Taking a look at the picture posted above, it clearly illustrates R7 Plus at left side and R7 at the side.
Glancing at the second image, the leaked picture portrays the bigger model at the right side and its back panel is decked with a fingerprint sensor that is located just below the camera unit. However, original model doesn't show fingerprint reader, but some things look identical between both handsets, which are 2.5D glass display, thin and metallic unibody.
Well, specifications of this mammoth invention of corporation is still a mystery, so we will have to wait to get a detailed information regarding mobile phone. On the other hand, information about some internal hardware of its companion, R7 had already been disclosed by various tipsters. Visit Here to know more about metal-clad R7. Moreover, multiple sources are suggesting that corporation is going to host an event on the 20th of May, where both the handhelds may see light of the day.
Source: weibo.com, gforgames.com