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Xiaomi, the Chinese smartphone manufacturer has unveiled lots of new smartphones during this year and it never stops their working to offer a new range of smartphones with better specifications and advanced technologies. Xiaomi, the Chinese tech giant is working on the successor of Mi Max 2 which was launched in India in the previous year at a price of Rs 16,999. It is anticipated that the company will launch the Mi Max 3 in the middle of 2018 similar to Mi Max 2 was also launched in the mid of the year.
Read Also: Redmi S2 Or Redmi Y2 Likely to Launch in India on 7th June
As posted by Lei Jun, CEO of Xiaomi has suggested that Mi Max 3 is likely to be unveiled in July this year. The answer of various questions related to launch of Mi Max 3 has been responded by Lei Jun on Chinese Certification Website, Weibo.
The benchmark details of new Xiaomi smartphone has been listed on Geekbench with the model name, ‘Valentino’ which reveals some of the specifications of the unnamed smartphone running on Android 8.1 Oreo operating system, paired with 6GB of RAM. It has scored 5,440 points in multi-core tests and 1485 points in single core tests which looks not so impressive.
As per the listings of Geekbench, the specs sheet has revealed that Xiaomi ‘Valentino’ model brings an SDM638 which indicating that it could be Qualcomm Snapdragon 638 SoC which would be used for the first time in Xiaomi smartphone. It is anticipated that Xiaomi MI Max 3 will be the first smartphone that will come with Qualcomm Snapdragon 638 processor.
According to the careful analysis, Xiaomi new phone with SDM638 multi-core and single core test performance do not have a big difference with Qualcomm Snapdragon 660 SoC specifically multi-core test performance. It is speculated that Qualcomm Snapdragon 638 SoC could be a lower version of Snapdragon 660
As per the previous leaks, it is confirmed that the Mi Max 3 will come with wireless charging, an iris scanner, 5,500 mAh battery and more. Earlier this month, the cover images of Xiaomi Mi Max 3 appeared on the internet which reveal the design of the upcoming smartphone. As per the images, the rear panel of the smartphone comprises vertically stacked dual rear cameras and the fingerprint scanner is positioned at the center on the rear panel. Three circular cutout is available on the top of the smartphone might be one for a 3.5mm audio jack, other for the IR blaster and currently, we don't know about the third cut-out. As per the case images of Mi Max 3, it seems that The USB port, microphone, and the speaker grill is placed on the bottom side of the smartphone. As per the case images, the power button and volume key buttons are positioned on the right-hand side of the smartphone.
According to the previous leak reports, the Mix Max 3 is likely to feature a a 6.99-inch Full HD+ display along with 18:9 aspect ratio. It will be powered by a Qualcomm Snapdragon 660 SoC. It is anticipated that it will run on Android Oreo coupled with top MIUI 9. It seems that it will be available in two storage options: 3GB RAM+64GB internal storage and 4GB RAM + 128GB internal storage.
An alleged Mi Max 3 upcoming smartphone gets a certification from 3C (China Compulsory Certification, CCC) website which pointing towards that the company would soon launch the successor of Mi Max in the China market.
Recently, the upcoming Mi Max 3 has been spotted on 3C (China Compulsory Certification, CCC) website with the model number “M1807E8S”. As per the 3C listings, an alleged upcoming Mi Max phablet would be manufactured by using Inventec (Nanjing) Technology as well as supports 5V DC 3A / 9V DC 2A / 12V DC 1.5A up to 18W fast charging with the help of “MDY-08-ES” power adapter. However, China’s 3C website has not revealed the detailed specifications of the smartphone.
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